Focus on EV Chaectronics

 Advanced Driver Assistance Systems (ADAS) and Infotainment units require high-speed data processing and extreme miniaturization. We provide:

Automotive Grade Quality Assurance

 Our facility operates under the IATF 16949 framework, ensuring that every board survives the harsh automotive environment (-40°C to +125°C).

• 100% 3D-AOI & AXI: Automated X-Ray inspection ensures zero voids in critical BGA and QFN solder joints.
• Harsh Environment Protection: Robotic Conformal Coating and Potting to resist vibration, humidity, and salt spray.
• Full Traceability: Component-level traceability for every PCBA shipped.

• The Challenge: A Tier-1 supplier faced latent failures in their 11kW OBC due to high solder voiding in power MOSFETs, leading to localized hotspots and thermal runaway.

• Our Solution: We implemented an Ultra-Low Voiding (ULV) solder paste chemistry combined with Specialized Aperture Design (matrix venting). We also optimized the Soak Zone profile to ensure maximum flux outgassing before the liquidus stage.

• The Result: Solder voiding was consistently reduced to meet stringent automotive standards, increasing first-pass yield to 99.5% and reducing field failures to near-zero PPM levels.

Manufacturing Challenges in Automotive Electronics

High Voltage & Power Density

EV systems such as OBC and BMS require handling high voltage (up to 800V+) and high current. This demands strict control of creepage, insulation, and thermal performance.

Signal Integrity for ADAS

Radar, LiDAR, and camera systems require high-frequency PCB assembly with extremely low signal loss and precise impedance control.

Thermal & Mechanical Stress

Automotive electronics operate under extreme environments (-40°C to +125°C), with continuous vibration, humidity, and thermal cycling stress.

Zero-Defect Manufacturing Requirement

Automotive electronics demand extremely low failure rates (PPM-level quality), requiring strict process control and full traceability.

EV & Automotive Power Electronics Expertise

Heavy Copper PCB Assembly (3oz–6oz)

We specialize in high-current PCB assembly with optimized thermal profiling for power electronics applications, ensuring low-resistance and stable power delivery.

SiC & GaN Power Device Assembly

Specialized reflow processes are used for Silicon Carbide (SiC) and Gallium Nitride (GaN) components to maximize efficiency and thermal stability in EV systems.

Creepage & High-Voltage Isolation Control

Strict process design ensures compliance with automotive safety requirements for high-voltage systems including 800V EV platforms.

ADAS & Smart Cockpit Manufacturing Capabilities

High-Speed Signal Integrity

We support automotive radar and vision systems using low-loss materials (Rogers, Panasonic) to ensure stable high-frequency performance.

HDI & Miniaturization Technology

Advanced HDI PCB assembly with blind/buried vias and 0201 ultra-small components for compact ADAS modules.

Thermal Management Solutions

Embedded copper coins, thermal vias, and heat dissipation structures ensure stable operation of AI processors and computing modules.

Automotive Grade Quality & Certification

Our automotive PCB assembly services operate under IATF 16949 quality management system, ensuring compliance with automotive industry standards.

• 100% 3D AOI Inspection
• X-Ray (AXI) Inspection for BGA/QFN
• ICT & Functional Testing (FCT)
• Burn-in & Reliability Testing
• Conformal Coating & Potting Protection

Every PCBA is fully traceable at component level, ensuring transparency and compliance for automotive production audits.

One-Stop Automotive PCB Assembly Services

PCB Fabrication

• FR4 PCB
• High-TG PCB
• Multilayer PCB
• Rigid-Flex PCB

Components Sourcing

• Automotive Grade Components
• BOM Optimization
• Long-Term Supply Stability
• Alternative Component Solutions

SMT & THT Assembly

• Fine-Pitch SMT Assembly
• BGA / QFN Assembly
• Through-Hole Assembly
• Mixed Technology Assembly

Programming & Functional Testing

• Firmware Programming
• ICT Testing
• Functional Circuit Testing (FCT)
• Burn-in Testing

Box Build Assembly

• Enclosure Assembly
• Cable Harness Integration
• Final System Assembly
• System-Level Testing

Automotive Manufacturing Process Control

APQP & PPAP Support Capability

We support automotive product development cycles including prototype, validation, pilot production, and mass production (EVT / DVT / PVT / SOP stages).

Full Traceability System

• Component-Level Traceability
• Lot Tracking System
• Serial Number Tracking
• Production Process Records

Stable Mass Production Capability

Designed for scalable automotive production with consistent quality across long-term supply programs.

Start Your Automotive PCB Assembly Project

Looking for a reliable automotive PCB assembly manufacturer for EV, ADAS, or automotive control systems?

We provide engineering support, DFM analysis, and scalable production from prototype to mass production.

Contact us today for a professional evaluation of your automotive electronics project.