Phone: +86-137 5102 2384
Phone: +86-137 5102 2384
Advanced Driver Assistance Systems (ADAS) and Infotainment units require high-speed data processing and extreme miniaturization. We provide:
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Requirement
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Our Manufacturing Solution
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Signal Integrity
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High-frequency PCB assembly using low-loss materials
(Rogers/Panasonic) for Radar & LiDAR.
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Miniaturization
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Multi-layer HDI technology with blind/buried vias and 0201
component placement.
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Thermal Dissipation
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Embedded copper coins and thermal via arrays to cool high-
performance AI processors.
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Our facility operates under the IATF 16949 framework, ensuring that every board survives the harsh automotive environment (-40°C to +125°C).
The Challenge: A Tier-1 supplier faced latent failures in their 11kW OBC due to high solder voiding in power MOSFETs, leading to localized hotspots and thermal runaway.
Our Solution: We implemented an Ultra-Low Voiding (ULV) solder paste chemistry combined with Specialized Aperture Design (matrix venting). We also optimized the Soak Zone profile to ensure maximum flux outgassing before the liquidus stage.
The Result: Solder voiding was consistently reduced to meet stringent automotive standards, increasing first-pass yield to 99.5% and reducing field failures to near-zero PPM levels.
Find Solutions, Not Just Suppliers
If you are interested in our services or looking for custom OEM & PCBA solutions, please feel free to contact us. We look forward to establishing successful business partnerships with you.
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